Physical aging of epoxy molding compound and its influences on the warpage of reconstituted wafer

Tz Cheng Chiu, Wei Jie Yin, En Yu Yeh, Yu Ting Yang, Dao Long Chen, Yi Hsiu Tseng

研究成果: Conference contribution

摘要

Epoxy molding compound (EMC) is a key constituent in large overmolded panel or wafer. During various packaging thermal processes, the thermal expansion mismatch between EMC and Si die and the shrinkage of EMC due to chemical or physical aging would lead to residual stress and warpage. For accurately predicting warpage in fan-out reconstituted wafer, the viscoelastic constitutive behavior and the physical aging characteristics were investigated. The viscoelastic behavior of the EMC were measured by quasi-static relaxation and creep experiments. Consistency of the viscoelastic behaviors measured from these two experiments were examined and compared to the viscoelastic model constructed from time-harmonic dynamic experiment. From the comparisons of these test results, it was found that the viscoelastic behavior measured by creep and relaxation tests are highly consistent, and the presence of physical aging in the dynamic test specimen delays the viscoelastic relaxation. In addition, physical aging leads to stress-free shrinkage comparable to the chemical-aging induced shrinkage. The chemical-thermomechanical constitutive model was also implemented to simulate warpage evolution of a reconstituted wafer.

原文English
主出版物標題Proceedings - IEEE 68th Electronic Components and Technology Conference, ECTC 2018
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1848-1855
頁數8
ISBN(列印)9781538649985
DOIs
出版狀態Published - 2018 八月 7
事件68th IEEE Electronic Components and Technology Conference, ECTC 2018 - San Diego, United States
持續時間: 2018 五月 292018 六月 1

出版系列

名字Proceedings - Electronic Components and Technology Conference
2018-May
ISSN(列印)0569-5503

Other

Other68th IEEE Electronic Components and Technology Conference, ECTC 2018
國家/地區United States
城市San Diego
期間18-05-2918-06-01

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 電氣與電子工程

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