This paper develops a placement procedure based a divide-and-conquer strategy for power hybrid circuits. In this method, the components with higher heat dissipation rate are evenly distributed apart, thus both the maximum temperature and the maximum temperature variation on the substrate are reduced. For other components the placement objective is to optimize the wirability. Since this placement procedure considers both reliability and routability together, it improves the circuit reliability, and only slightly increases the total wiring lengths when compares to the force directed placement algorithm.
|出版狀態||Published - 1995 一月 1|
|事件||Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2) - Maui, HI, USA|
持續時間: 1995 三月 26 → 1995 三月 30
|Other||Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2)|
|城市||Maui, HI, USA|
|期間||95-03-26 → 95-03-30|
All Science Journal Classification (ASJC) codes