Placement with reliability and wirability for power hybrid circuits

Jing Lee, Jung Hua Chou, Shen Li Fu

研究成果: Paper同行評審

摘要

This paper develops a placement procedure based a divide-and-conquer strategy for power hybrid circuits. In this method, the components with higher heat dissipation rate are evenly distributed apart, thus both the maximum temperature and the maximum temperature variation on the substrate are reduced. For other components the placement objective is to optimize the wirability. Since this placement procedure considers both reliability and routability together, it improves the circuit reliability, and only slightly increases the total wiring lengths when compares to the force directed placement algorithm.

原文English
頁面915-920
頁數6
出版狀態Published - 1995 一月 1
事件Proceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2) - Maui, HI, USA
持續時間: 1995 三月 261995 三月 30

Other

OtherProceedings of the International Intersociety Electronic Packaging Conference - INTERpack'95. Part 1 (of 2)
城市Maui, HI, USA
期間95-03-2695-03-30

All Science Journal Classification (ASJC) codes

  • 機械工業
  • 電氣與電子工程

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