Plasma resistance and behavior of polybenzoxazine polymer

Jem Kun Chen, Kuang-I Lin, Fu Hsiang Ko, Feng Chih Chang, Feng Chih Chen

研究成果: Conference contribution

摘要

The structure of B-a type polybenzoxazine(PBZZ) is similar to phenolic resin through thermal self-curing of the heterocyclic ring opening reaction that neither requires catalyst nor releases any condensation byproduct. These PBZZ resins are found to possess several outstanding properties such as near no shrinkage after curing, high thermal stability and low water absorption. Furthermore, the PBZZ has high glass transition temperature even though it has relatively low cross linking density. Hence, the PBZZ polymer is a candidate material for IC manufacturing. The plasma treatment of this polymer is reported here.

原文English
主出版物標題Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003
發行者Institute of Electrical and Electronics Engineers Inc.
頁面260-261
頁數2
ISBN(電子)4891140402, 9784891140403
DOIs
出版狀態Published - 2003 一月 1
事件International Microprocesses and Nanotechnology Conference, MNC 2003 - Tokyo, Japan
持續時間: 2003 十月 292003 十月 31

出版系列

名字Digest of Papers - Microprocesses and Nanotechnology 2003 - 2003 International Microprocesses and Nanotechnology Conference, MNC 2003

Conference

ConferenceInternational Microprocesses and Nanotechnology Conference, MNC 2003
國家/地區Japan
城市Tokyo
期間03-10-2903-10-31

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 電氣與電子工程

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