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Prediction of flow induced lead deflection of leadframe assemblies in plastic encapsulation during molding

  • J. Y. Chen
  • , S. Y. Teng
  • , S. J. Hwang
  • , H. H. Lee
  • , D. Y. Huang
  • , Y. J. Lin
  • , Stoke Chen
  • , G. S. Shen
  • , Lily Wu

研究成果: Conference contribution

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Material Science

Engineering