Prediction of paddle shift via 3-D TSOP modeling

Francis Su; Sheng Jye Hwang; Huei Huang Lee; Durn Yuan Huang

doi:10.1109/6144.888854

Prediction of paddle shift via 3-D TSOP modeling

Francis Su, Sheng Jye Hwang, Huei Huang Lee, Durn Yuan Huang

研究成果: Article › 同行評審

11 引文斯高帕斯（Scopus）

摘要

This study is to develop a methodology to simulate the molding process of thin small outline packages (TSOPs) and to predict the paddle shift caused by pressure difference and viscous stress during molding through the help of a true three-dimensional (3-D) Computational Fluid Dynamics (CFD) software.

原文	English
頁（從 - 到）	684-692
頁數	9
期刊	IEEE Transactions on Components and Packaging Technologies
卷	23
發行號	4
DOIs	https://doi.org/10.1109/6144.888854
出版狀態	Published - 2000 12月

All Science Journal Classification (ASJC) codes

電子、光磁材料
電氣與電子工程

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10.1109/6144.888854

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引用此

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abstract = "This study is to develop a methodology to simulate the molding process of thin small outline packages (TSOPs) and to predict the paddle shift caused by pressure difference and viscous stress during molding through the help of a true three-dimensional (3-D) Computational Fluid Dynamics (CFD) software.",

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AB - This study is to develop a methodology to simulate the molding process of thin small outline packages (TSOPs) and to predict the paddle shift caused by pressure difference and viscous stress during molding through the help of a true three-dimensional (3-D) Computational Fluid Dynamics (CFD) software.

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Prediction of paddle shift via 3-D TSOP modeling

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