Preliminary study of an intelligent sampling decision scheme for the AVM system

Chun Fang Chen, Fan Tien Cheng, Chu Chieh Wu, Hsuan Heng Huang

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

Wafer inspection plays a significant role in monitoring the quality of production wafers. However, it requires measuring tools and additional cycle time to do real metrology, which is costly and time-consuming. Therefore, reducing sampling rate to as low as possible is a high priority for many factories to reduce production cost. The most common way for inspecting process quality is to apply periodic sampling. If a manufacturing process is stable, then virtual metrology (VM) may be applied for monitoring the quality of wafers while real metrology is unavailable. Nevertheless, if a production variation occurs between periodic samplings, no real metrology is available during this period for updating the VM models, which may result in un-reliable VM predictions. The authors have developed the automatic virtual metrology (AVM) system for various VM applications. Therefore, this paper focuses on applying various indices of the AVM system to develop an Intelligent Sampling Decision (ISD) scheme for reducing sampling rate while VM accuracy is still sustained.

原文English
主出版物標題Proceedings - IEEE International Conference on Robotics and Automation
發行者Institute of Electrical and Electronics Engineers Inc.
頁面3496-3501
頁數6
ISBN(電子)9781479936854, 9781479936854
DOIs
出版狀態Published - 2014 九月 22
事件2014 IEEE International Conference on Robotics and Automation, ICRA 2014 - Hong Kong, China
持續時間: 2014 五月 312014 六月 7

出版系列

名字Proceedings - IEEE International Conference on Robotics and Automation
ISSN(列印)1050-4729

Other

Other2014 IEEE International Conference on Robotics and Automation, ICRA 2014
國家/地區China
城市Hong Kong
期間14-05-3114-06-07

All Science Journal Classification (ASJC) codes

  • 軟體
  • 控制與系統工程
  • 人工智慧
  • 電氣與電子工程

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