Preparation and properties of thermally conductive photosensitive polyimide/boron nitride nanocomposites

研究成果: Article同行評審

49 引文 斯高帕斯(Scopus)

摘要

A new thermally conductive photoresist was developed. It was based on a dispersion of boron nitride (BN) nanoflakes in a negative-tone photosensitive polyimide (PSPI) precursor. 3-Mercaptopropionic acid was used as the surfactant to modify the BN nanoflake surface for the dispersion of BN nanoflakes in the polymer. The thermal conductivity of the composite films increased with increasing BN fraction. The thermal conductivity of the PSPI/BN nanocomposite was up to 0.47 W m-1 K-1 for a mixture containing 30 wt % nanosized BN filler in the polyimide matrix. Patterns with a resolution of 30 μ were obtained from the PSPI/BN nanocomposites. The PSPI/BN nanocomposites had excellent thermal properties. Their glass-transition temperatures were above 360°C, and the thermal decomposition temperatures were over 460°C.

原文English
頁(從 - 到)916-922
頁數7
期刊Journal of Applied Polymer Science
121
發行號2
DOIs
出版狀態Published - 2011 七月 15

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Surfaces, Coatings and Films
  • Polymers and Plastics
  • Materials Chemistry

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