Preparation of solder bumps incorporating electroless nickel-boron deposit and investigation on the interfacial interaction behaviour and wetting kinetics

Chwan Ying Lee, Kwang Lung Lin

研究成果: Article同行評審

23 引文 斯高帕斯(Scopus)

摘要

Investigation of a method for preparing solder bumps on AI pads incorporating electroless nickel deposition and soldering for solder bumps was undertaken. The experimental variables included bath temperature and dipping velocity. The formation of intermetallic compounds and wetting kinetics between electroless Ni-B deposit and molten solder was also investigated. The interfacial interaction behaviour was studied with the aid of Auger depth profile and scanning electron microscopy. Intermetallic compounds Ni3Sn4 and Ni3Sn2 were formed between the Ni-B deposit and solder. Aluminium atoms diffuse through the intermetallic compound layer and dissolve in the solder when the electroless Ni-B deposit is entirely consumed. The contact angles of molten solder on a Ni-B deposit, measured with the sessile drop method, decrease with increasing temperature and time. The activation energy for wetting of molten solder on a Ni-B deposit was estimated to be 208.27 kcal mol-1.

原文English
頁(從 - 到)377-383
頁數7
期刊Journal of Materials Science: Materials in Electronics
8
發行號6
DOIs
出版狀態Published - 1997

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 原子與分子物理與光學
  • 凝聚態物理學
  • 電氣與電子工程

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