Process emulation for predicting die shift and wafer warpage in wafer reconstitution

C. Y. Yang, Y. C. Liu, Kuo-Shen Chen, Tian-Shiang Yang, Y. C. Wang, S. S. Lee

研究成果: Conference contribution

2 引文 (Scopus)

摘要

Wafer reconstitution is a vital process for serving as a buffer to decouple the processing developments between IC fabrication and electronics packaging. By this approach, the IC packaging is then independent from the chip processing. However, such a process brings numerous mechanical loadings during molding and curing phases. Without carefully planning, failures such as die-shifting and excessive wafer warpages are frequently reported and it induces problems for subsequent processing. In this work, it is desired to examine the key factor of die-shift and wafer warpage by performing both fluidic mold flow and solid thermo-mechanical analyses, as well as essential material characterizations. Preliminarily, the die-shift problem is deduced as interaction of fluid load, thermal expansion, shrinkage of molding compound and viscoelastic effect. To have a deeper insight, simplified fluid model and finite element analyses have been constructed to mimic the entire Recon process. For mold flow analysis, a simplified 1-D viscous flow analytical model is adapted. It aims to find the relationship between the molding parameters and the achieved velocity and pressure fields for calculating the possible drag and shear forces acting on dies for causing shift. On the other hand, after molding, the stress and deformation of the entire curing process is then performed by finite element method. The possible die shift and final warpage are then examined step by step to evaluate the contribution from each step and even each processing parameter. Both simplified 2-D axisymmetric and 3D models are performed and analyzed. The preliminary analysis results indicate that the thermal stress during curing is the current dominating factor. Related parameters such as the properties of compounds and carriers and the process parameters such as the curing temperature and duration could be the major controlling factors.

原文English
主出版物標題18th International Conference on Electronic Packaging Technology, ICEPT 2017
編輯Chenxi Wang, Yanhong Tian, Tianchun Ye
發行者Institute of Electrical and Electronics Engineers Inc.
頁面215-220
頁數6
ISBN(電子)9781538629727
DOIs
出版狀態Published - 2017 九月 19
事件18th International Conference on Electronic Packaging Technology, ICEPT 2017 - Harbin, China
持續時間: 2017 八月 162017 八月 19

出版系列

名字18th International Conference on Electronic Packaging Technology, ICEPT 2017

Other

Other18th International Conference on Electronic Packaging Technology, ICEPT 2017
國家China
城市Harbin
期間17-08-1617-08-19

指紋

Curing
Molding
Processing
Sheet molding compounds
Electronics packaging
Fluids
Fluidics
Viscous flow
Thermal stress
Thermal expansion
Drag
Analytical models
Packaging
Buffers
Finite element method
Planning
Fabrication
Temperature

All Science Journal Classification (ASJC) codes

  • Ceramics and Composites
  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys
  • Polymers and Plastics
  • Electrical and Electronic Engineering
  • Industrial and Manufacturing Engineering

引用此文

Yang, C. Y., Liu, Y. C., Chen, K-S., Yang, T-S., Wang, Y. C., & Lee, S. S. (2017). Process emulation for predicting die shift and wafer warpage in wafer reconstitution. 於 C. Wang, Y. Tian, & T. Ye (編輯), 18th International Conference on Electronic Packaging Technology, ICEPT 2017 (頁 215-220). [8046441] (18th International Conference on Electronic Packaging Technology, ICEPT 2017). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEPT.2017.8046441
Yang, C. Y. ; Liu, Y. C. ; Chen, Kuo-Shen ; Yang, Tian-Shiang ; Wang, Y. C. ; Lee, S. S. / Process emulation for predicting die shift and wafer warpage in wafer reconstitution. 18th International Conference on Electronic Packaging Technology, ICEPT 2017. 編輯 / Chenxi Wang ; Yanhong Tian ; Tianchun Ye. Institute of Electrical and Electronics Engineers Inc., 2017. 頁 215-220 (18th International Conference on Electronic Packaging Technology, ICEPT 2017).
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abstract = "Wafer reconstitution is a vital process for serving as a buffer to decouple the processing developments between IC fabrication and electronics packaging. By this approach, the IC packaging is then independent from the chip processing. However, such a process brings numerous mechanical loadings during molding and curing phases. Without carefully planning, failures such as die-shifting and excessive wafer warpages are frequently reported and it induces problems for subsequent processing. In this work, it is desired to examine the key factor of die-shift and wafer warpage by performing both fluidic mold flow and solid thermo-mechanical analyses, as well as essential material characterizations. Preliminarily, the die-shift problem is deduced as interaction of fluid load, thermal expansion, shrinkage of molding compound and viscoelastic effect. To have a deeper insight, simplified fluid model and finite element analyses have been constructed to mimic the entire Recon process. For mold flow analysis, a simplified 1-D viscous flow analytical model is adapted. It aims to find the relationship between the molding parameters and the achieved velocity and pressure fields for calculating the possible drag and shear forces acting on dies for causing shift. On the other hand, after molding, the stress and deformation of the entire curing process is then performed by finite element method. The possible die shift and final warpage are then examined step by step to evaluate the contribution from each step and even each processing parameter. Both simplified 2-D axisymmetric and 3D models are performed and analyzed. The preliminary analysis results indicate that the thermal stress during curing is the current dominating factor. Related parameters such as the properties of compounds and carriers and the process parameters such as the curing temperature and duration could be the major controlling factors.",
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Yang, CY, Liu, YC, Chen, K-S, Yang, T-S, Wang, YC & Lee, SS 2017, Process emulation for predicting die shift and wafer warpage in wafer reconstitution. 於 C Wang, Y Tian & T Ye (編輯), 18th International Conference on Electronic Packaging Technology, ICEPT 2017., 8046441, 18th International Conference on Electronic Packaging Technology, ICEPT 2017, Institute of Electrical and Electronics Engineers Inc., 頁 215-220, 18th International Conference on Electronic Packaging Technology, ICEPT 2017, Harbin, China, 17-08-16. https://doi.org/10.1109/ICEPT.2017.8046441

Process emulation for predicting die shift and wafer warpage in wafer reconstitution. / Yang, C. Y.; Liu, Y. C.; Chen, Kuo-Shen; Yang, Tian-Shiang; Wang, Y. C.; Lee, S. S.

18th International Conference on Electronic Packaging Technology, ICEPT 2017. 編輯 / Chenxi Wang; Yanhong Tian; Tianchun Ye. Institute of Electrical and Electronics Engineers Inc., 2017. p. 215-220 8046441 (18th International Conference on Electronic Packaging Technology, ICEPT 2017).

研究成果: Conference contribution

TY - GEN

T1 - Process emulation for predicting die shift and wafer warpage in wafer reconstitution

AU - Yang, C. Y.

AU - Liu, Y. C.

AU - Chen, Kuo-Shen

AU - Yang, Tian-Shiang

AU - Wang, Y. C.

AU - Lee, S. S.

PY - 2017/9/19

Y1 - 2017/9/19

N2 - Wafer reconstitution is a vital process for serving as a buffer to decouple the processing developments between IC fabrication and electronics packaging. By this approach, the IC packaging is then independent from the chip processing. However, such a process brings numerous mechanical loadings during molding and curing phases. Without carefully planning, failures such as die-shifting and excessive wafer warpages are frequently reported and it induces problems for subsequent processing. In this work, it is desired to examine the key factor of die-shift and wafer warpage by performing both fluidic mold flow and solid thermo-mechanical analyses, as well as essential material characterizations. Preliminarily, the die-shift problem is deduced as interaction of fluid load, thermal expansion, shrinkage of molding compound and viscoelastic effect. To have a deeper insight, simplified fluid model and finite element analyses have been constructed to mimic the entire Recon process. For mold flow analysis, a simplified 1-D viscous flow analytical model is adapted. It aims to find the relationship between the molding parameters and the achieved velocity and pressure fields for calculating the possible drag and shear forces acting on dies for causing shift. On the other hand, after molding, the stress and deformation of the entire curing process is then performed by finite element method. The possible die shift and final warpage are then examined step by step to evaluate the contribution from each step and even each processing parameter. Both simplified 2-D axisymmetric and 3D models are performed and analyzed. The preliminary analysis results indicate that the thermal stress during curing is the current dominating factor. Related parameters such as the properties of compounds and carriers and the process parameters such as the curing temperature and duration could be the major controlling factors.

AB - Wafer reconstitution is a vital process for serving as a buffer to decouple the processing developments between IC fabrication and electronics packaging. By this approach, the IC packaging is then independent from the chip processing. However, such a process brings numerous mechanical loadings during molding and curing phases. Without carefully planning, failures such as die-shifting and excessive wafer warpages are frequently reported and it induces problems for subsequent processing. In this work, it is desired to examine the key factor of die-shift and wafer warpage by performing both fluidic mold flow and solid thermo-mechanical analyses, as well as essential material characterizations. Preliminarily, the die-shift problem is deduced as interaction of fluid load, thermal expansion, shrinkage of molding compound and viscoelastic effect. To have a deeper insight, simplified fluid model and finite element analyses have been constructed to mimic the entire Recon process. For mold flow analysis, a simplified 1-D viscous flow analytical model is adapted. It aims to find the relationship between the molding parameters and the achieved velocity and pressure fields for calculating the possible drag and shear forces acting on dies for causing shift. On the other hand, after molding, the stress and deformation of the entire curing process is then performed by finite element method. The possible die shift and final warpage are then examined step by step to evaluate the contribution from each step and even each processing parameter. Both simplified 2-D axisymmetric and 3D models are performed and analyzed. The preliminary analysis results indicate that the thermal stress during curing is the current dominating factor. Related parameters such as the properties of compounds and carriers and the process parameters such as the curing temperature and duration could be the major controlling factors.

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M3 - Conference contribution

AN - SCOPUS:85032820952

T3 - 18th International Conference on Electronic Packaging Technology, ICEPT 2017

SP - 215

EP - 220

BT - 18th International Conference on Electronic Packaging Technology, ICEPT 2017

A2 - Wang, Chenxi

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PB - Institute of Electrical and Electronics Engineers Inc.

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Yang CY, Liu YC, Chen K-S, Yang T-S, Wang YC, Lee SS. Process emulation for predicting die shift and wafer warpage in wafer reconstitution. 於 Wang C, Tian Y, Ye T, 編輯, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Institute of Electrical and Electronics Engineers Inc. 2017. p. 215-220. 8046441. (18th International Conference on Electronic Packaging Technology, ICEPT 2017). https://doi.org/10.1109/ICEPT.2017.8046441