Processing and characterizations of a novel integral dielectric heat sink material

This paper describes a novel integral dielectric heat sink material consisting of diamond deposited carbon/carbon composite with metallic layer(s) on the diamond surface. The carbon/carbon composite was processed using pitch infiltration into highly graphitic carbon fiber preform. Polycrystalline diamond was applied using a microwave reactor. Surface metallization was performed using an electron beam evaporation technique. The resulting material was characterized for its microstructure, thermal conductivity, resistance to thermal cycling, and the thickness of metallized layer.