Pulsed electrodeposition of CuInSe2 thin films onto Mo-glass substrates

Shao Yu Hu, Wen Hsi Lee, Shih Chieh Chang, Yi Lung Cheng, Ying Lang Wang

研究成果: Article同行評審

14 引文 斯高帕斯(Scopus)

摘要

In this study, copper indium selenide (CIS) films were deposited by pulsed electrodeposition with multi potentials to control the atomic ratio of the CIS film and improve the deposition uniformity. It was found that smaller duty cycle and pulsed period enhanced the cathodic current due to ion replenishment. The results show that the CuIn ratio was significantly influenced by reverse voltage of pulsed electrodeposition. The uniformity of the CIS films can be improved by proper reverse voltage. The deposition rate did not decrease in direct proportion to the duty cycle because the plating current was enhanced by the pulse effect. The pulsed deposited CIS film with optimized composition show smaller grain size, smoother microstructure, and less secondary phase than constant deposited film.

原文English
頁(從 - 到)B557-B561
期刊Journal of the Electrochemical Society
158
發行號5
DOIs
出版狀態Published - 2011 四月 4

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Renewable Energy, Sustainability and the Environment
  • Surfaces, Coatings and Films
  • Electrochemistry
  • Materials Chemistry

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