TY - GEN
T1 - Qorvo's emerging GaN technologies for mmWave applications
AU - Cao, Y.
AU - Kumar, V.
AU - Chen, S.
AU - Cui, Y.
AU - Yoon, S.
AU - Beam, E.
AU - Xie, A.
AU - Jimenez, J.
AU - Ketterson, A.
AU - Lee, C.
AU - Linkhart, Douglas
AU - Geiler, Anton
N1 - Funding Information:
ACKNOWLEDGMENT This work is partially supported by DARPA with Contract No. W911NF-17-0029. We acknowledge the program support from Dr. David Kirkwood, Dr. Marc Ulrich, and Program Manager Dr. Young-Kai Chen and Dr. David Abe.
Publisher Copyright:
© 2020 IEEE.
PY - 2020/8
Y1 - 2020/8
N2 - Recent GaN related research efforts on both GaN based transistors and passive devices like self-biased circulators will be discussed. Commercial mmW Applications are demanding for GaN technology with more aggressive device scaling, starting from the gate length of 150 nm, towards 90 nm and below. New epitaxy design is required to further reduce parasitic resistances below that can be achieved from traditional AlGaN/GaN structures. We have developed 90 nm GaN (GaN09) HEMT technology based on an AlN/GaN based digital barrier. This new structure, combined with our T-Gate process, has enabled great efficiency improvement in both devices and circuits. The GaN transistors have shown a peak PAE of 51% with the output power density of 2.25 W/mm at 35 GHz. In future phased array mmW applications where full-duplex communication is desirable, conventional circulator technology can not be used due to the bulky device sizes. Our new Ka-band self-biased circulator technology integrated on GaN/SiC provides superior SWaP performance by showing an insertion loss of <0.5 dB and isolation >25 dB within an active device junction area of 1.5 mm in diameter. This technology will pave the path for 5G duplex communication systems using phased array antennas.
AB - Recent GaN related research efforts on both GaN based transistors and passive devices like self-biased circulators will be discussed. Commercial mmW Applications are demanding for GaN technology with more aggressive device scaling, starting from the gate length of 150 nm, towards 90 nm and below. New epitaxy design is required to further reduce parasitic resistances below that can be achieved from traditional AlGaN/GaN structures. We have developed 90 nm GaN (GaN09) HEMT technology based on an AlN/GaN based digital barrier. This new structure, combined with our T-Gate process, has enabled great efficiency improvement in both devices and circuits. The GaN transistors have shown a peak PAE of 51% with the output power density of 2.25 W/mm at 35 GHz. In future phased array mmW applications where full-duplex communication is desirable, conventional circulator technology can not be used due to the bulky device sizes. Our new Ka-band self-biased circulator technology integrated on GaN/SiC provides superior SWaP performance by showing an insertion loss of <0.5 dB and isolation >25 dB within an active device junction area of 1.5 mm in diameter. This technology will pave the path for 5G duplex communication systems using phased array antennas.
UR - https://www.scopus.com/pages/publications/85094189356
UR - https://www.scopus.com/inward/citedby.url?scp=85094189356&partnerID=8YFLogxK
U2 - 10.1109/IMS30576.2020.9223913
DO - 10.1109/IMS30576.2020.9223913
M3 - Conference contribution
AN - SCOPUS:85094189356
T3 - IEEE MTT-S International Microwave Symposium Digest
SP - 570
EP - 572
BT - IMS 2020 - 2020 IEEE/MTT-S International Microwave Symposium
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2020 IEEE/MTT-S International Microwave Symposium, IMS 2020
Y2 - 4 August 2020 through 6 August 2020
ER -