Quantitative reliability prediction model for wafer level packages under board-level temperature cycling

Hung Chun Yang, Chin Li Kao, Tz Cheng Chiu, Chang Chi Lee, Sung Ching Hung, Chih Pin Hung

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

A damage accumulation based interconnect fatigue failure model is developed for predicting the board-level temperature cycling (T/C) reliability of wafer level packages (WLPs). Creep and constant strain rate experiments were first performed to characterize the viscoplastic constitutive behavior of Pb-free solder. Finite element (FE) analyses based on the viscoplastic models were conducted for estimating inelastic strain energy density accumulation. The numerical results were then compared to a library of board-level T/C reliability test results for best fitting the reliability model. Factors such as alloy Ag content, package geometry, and ball grid array (BGA) layout are considered in the model.

原文English
主出版物標題2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
主出版物子標題Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
發行者Institute of Electrical and Electronics Engineers Inc.
頁面325-328
頁數4
ISBN(電子)9781479977277
DOIs
出版狀態Published - 2014 一月 1
事件9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014 - Taipei, Taiwan
持續時間: 2014 十月 222014 十月 24

出版系列

名字2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings

Other

Other9th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2014
國家/地區Taiwan
城市Taipei
期間14-10-2214-10-24

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 電氣與電子工程
  • 控制與系統工程

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