Reactive wetting behaviors of Sn/Cu systems: A molecular dynamics study

J. Y. Hsieh, J. L. Chen, C. Chen, H. C. Lin, S. S. Yang, C. C. Hwang

研究成果: Article同行評審

17 引文 斯高帕斯(Scopus)

摘要

Influences of temperature and Sn-Cu droplet's composition on reactive wettings of Cu(100), Cu(110), and Cu(111) surfaces were analyzed, by using molecular dynamics (MD) calculations. As a result, the spreading on Cu(110)(Cu(100)) has the fastest (slowest) wetting kinetics. A higher temperature or a diluter Cu content in the Sn-Cu alloy droplet results in a higher wettability. Moreover, this work has addressed a theory for positioning the interface separating the liquidus and solidus alloys in the spreading film to confirm the hypothesis that the reactive wetting will come to the end when the interface saturates with the temperature-dependent solidus weight fraction of Cu.

原文English
頁(從 - 到)60-67
頁數8
期刊Nano-Micro Letters
2
發行號2
DOIs
出版狀態Published - 2010

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 表面、塗料和薄膜
  • 電氣與電子工程

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