@inproceedings{c99e1f91fdc846a0ad907514d976f532,
title = "Real-time monitoring via patch-type piezoelectric force sensors for Internet of Thing in logistics",
abstract = "We propose the use of simple and low cost piezoelectric based patch type sensors that ensure safety of the package while also detecting damage during shipment. A tear off sensor located at the top of the package can identify if the package has been opened while an impact sensor located at the bottom can monitor the damage suffered. The sensors are connected to a low power prototype read out device with a microcontroller (MCU) unit to analyze the data and a radio frequency (RF) module to transfer the data wirelessly. It would be viable to have an on-vehicle telematics device for collecting and analyzing data from multiple packages wirelessly so that it can be uploaded to the cloud, thus allowing for real time monitoring during transport. This logistics management model would aid in improving the quality of services provided by the logistics company while also earning consumer credibility. Thus, we believe that these patch type force sensors can be realistically implemented in logistics in the near future.",
author = "Chuang, {Cheng Hsin} and Weng, {Wan Ching} and Chang, {Wan Jung} and Lee, {Da Huei}",
note = "Publisher Copyright: {\textcopyright} 2016 IEEE.; 11th IEEE Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016 ; Conference date: 17-04-2016 Through 20-04-2016",
year = "2016",
month = nov,
day = "28",
doi = "10.1109/NEMS.2016.7758259",
language = "English",
series = "2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "325--328",
booktitle = "2016 IEEE 11th Annual International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2016",
address = "United States",
}