Recrystallization and fracture characteristics of thin copper wire

Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Yuan Tin Wang

研究成果: Article同行評審

22 引文 斯高帕斯(Scopus)

摘要

In this study, the annealed effect (at 150 °C ∼ 250 °C for 1 h) on the tensile mechanical properties of thin copper wires with φ = 25 μm (1 mil) was investigated. The microstructural characteristics and the mechanical properties before and after an electric flame-off (EFO) were also studied. Results indicate that with annealing temperatures of more than 200 °C, the wires possessed a fully annealed structure, the tensile strength and the hardness decreased, and the elongation was raised significantly. Through recrystallization, equiaxed grains and a few annealed twins formed in the matrix structure. The microstructures of the free air ball (FAB) of the various wires after EFO contained column-like grains. The column-like grains grew from the heat-affected zone (HAZ) to the Cu ball, and the preferred orientation was <100>. According to Weibull's reliability analysis, the failure rates of all the specimens were the modus of wear-failure. The tensile strength and the reliability of both the 200 °C and 250 °C annealed wires in the HAZs showed the highest values of all.

原文English
頁(從 - 到)5476-5482
頁數7
期刊Journal of Materials Science
42
發行號14
DOIs
出版狀態Published - 2007 7月

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 材料力學
  • 機械工業

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