Recrystallization of Ag and Ag-La alloy wire in wire bonding process

Hao Wen Hsueh, Fei Yi Hung, Truan Sheng Lui

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)

摘要

Sliver wire was the novel material to replaced gold wire in wire bonding process, and rare earth element was often added to improve the properties of silver wires. The annealing effect (at 225°C~275°C for 30min) on the tensile mechanical properties of silver wires with φ=20μm was investigated. In addition, the microstructural characteristics and the mechanical properties before and after an electric flame-off (EFO) process were also studied. Free-air ball (FAB) of 85μm diameter from 20μm diameter pure silver wire was too huge for bonding process, otherwise the silver wire was added 0.05 wt.% lanthanum to form Ag-La alloy wire to reduce the diameter of FAB. FAB of Ag-La alloy wire with a 55μm diameter, and can avoid short-circuited. In addition, microstructures, tensile properties and the micro-hardness of Ag-La alloy wires indicated that the best annealing temperature was 425°C.

原文English
主出版物標題Materials and Measurement
頁面151-157
頁數7
DOIs
出版狀態Published - 2013
事件2013 International Conference on Intelligent Materials and Measurement, ICIMM 2013 - , Singapore
持續時間: 2013 7月 272013 7月 28

出版系列

名字Advanced Materials Research
804
ISSN(列印)1022-6680

Other

Other2013 International Conference on Intelligent Materials and Measurement, ICIMM 2013
國家/地區Singapore
期間13-07-2713-07-28

All Science Journal Classification (ASJC) codes

  • 一般工程

指紋

深入研究「Recrystallization of Ag and Ag-La alloy wire in wire bonding process」主題。共同形成了獨特的指紋。

引用此