Relationship between Parent and Twin Orientations in Pulse Electrodeposited Copper

Y.-w. Lin, J.-c. Kuo

研究成果: Article

原文English
頁(從 - 到)D19-D21
期刊ECS Electrochemistry Letters
2
發行號4
DOIs
出版狀態Published - 2013 一月 29

引用此文

@article{a59a1919bdd545b0adb40df45878c070,
title = "Relationship between Parent and Twin Orientations in Pulse Electrodeposited Copper",
author = "Y.-w. Lin and J.-c. Kuo",
year = "2013",
month = "1",
day = "29",
doi = "10.1149/2.006304eel",
language = "English",
volume = "2",
pages = "D19--D21",
journal = "ECS Electrochemistry Letters",
issn = "2162-8726",
publisher = "The Electrochemical Society",
number = "4",

}

Relationship between Parent and Twin Orientations in Pulse Electrodeposited Copper. / Lin, Y.-w.; Kuo, J.-c.

於: ECS Electrochemistry Letters, 卷 2, 編號 4, 29.01.2013, p. D19-D21.

研究成果: Article

TY - JOUR

T1 - Relationship between Parent and Twin Orientations in Pulse Electrodeposited Copper

AU - Lin, Y.-w.

AU - Kuo, J.-c.

PY - 2013/1/29

Y1 - 2013/1/29

U2 - 10.1149/2.006304eel

DO - 10.1149/2.006304eel

M3 - Article

VL - 2

SP - D19-D21

JO - ECS Electrochemistry Letters

JF - ECS Electrochemistry Letters

SN - 2162-8726

IS - 4

ER -