Reliability and wirability optimizations for module placement on a convectively cooled printed wiring board

Jing Lee, Jung Hua Chou, Shen Li Fu

研究成果: Article同行評審

19 引文 斯高帕斯(Scopus)

摘要

Traditionally, printed wiring board (PWB) placement techniques have been focused on improving wirability. However, with the increasing demand for highly reliable densely packaged electronic equipment, considerable attention has been focused on the methods which can improve reliability at higher packaging levels. This paper considers both reliability and wirability together for arranging electronic modules on a convectively cooled printed wiring board. An ordered best-first search algorithm is presented for the two-objective optimization problem. The algorithm always examines the "successors" of the "most promising" node in the search tree. The results show that the system failure rate can be greatly reduced without deteriorating the wirability. Furthermore, the first obtained solution which satisfies the bound on wirability was demonstrated to have very high quality in system failure rate. Thus, the method can be used for large-sized problems if the solutions needed are only nearly optimum. On the other hand, for small-sized problems, the Pareto optimal solutions can be obtained by the method.

原文English
頁(從 - 到)173-186
頁數14
期刊Integration, the VLSI Journal
18
發行號2-3
DOIs
出版狀態Published - 1995 六月

All Science Journal Classification (ASJC) codes

  • Software
  • Hardware and Architecture
  • Electrical and Electronic Engineering

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