@inproceedings{cb9523268ccb473e95831c6e93c976de,
title = "Reliability of ball grid array subjected to temperature cycling",
abstract = "This study established a simulation model for reliability of Ball Grid Array (BGA) IC package subjected to temperature cycling. COMSOL Multiphysics software was used to established a simulation model and this study used Garofalo-Arrheniuss Law creep equation and Modified Coffin-Manson equation to estimate fatigue life of chip subjected to temperature cycling test (TCT). Since the thermal expansion coefficients between the materials are mismatch, chip would occur warpage. The solder ball of peripheral edge was cracked firstly, and the estimated error of solder ball life is 15.7\% compared with experimental value. This study could find out the position where the solder ball first cracked which was not the position of maximum stress but was the position of the maximum strain range.",
author = "Chuang, \{Wan Chun\} and Ben Tsai and Chen, \{Wei Long\} and Josh Su",
note = "Publisher Copyright: {\textcopyright} 2017 IEEE.; 19th Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017 ; Conference date: 29-05-2017 Through 01-06-2017",
year = "2017",
month = jul,
day = "18",
doi = "10.1109/DTIP.2017.7984491",
language = "English",
series = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
editor = "Benoit Charlot and Pascal Nouet and Claude Pellet and Yoshio Mita and Francis Pressecq and Peter Schneider and Stewart Smith",
booktitle = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2017",
address = "United States",
}