Removing metal debris from thermosetting EMC powders by Nd-Fe-B permanent magnets

Yowching Liaw, Jung Hua Chou, Shouyen Chao

研究成果: Conference article同行評審

摘要

During the preparation of thermosetting encapsulation molding compounds (EMCs) for semiconductor packaging, metal debris are always present in the EMC powders due to the hard silica fillers in the compound. These metal debris in the EMC powders will cause circuit shortage and therefore have to be removed before molding. In this study, Nd-Fe-B permanent magnets are used to remove these debris. The results show that the metal debris can be removed effectively as the rate of accumulation of the metal debris increases as time proceeds in the removing operation. The removal effectiveness of the debris is affected by both the magnetic flux density and the flow around the magnet. The wake flow behind the magnet is a relatively low speed recirculation region which facilities the attraction of metal debris in the powders. Thus, the largest amount of the accumulated EMC powders occurs downstream of the magnet. Hence, this low speed recirculation region should be better utilized to enhance the removal efficiency of the metal debris.

原文English
文章編號03009
期刊MATEC Web of Conferences
130
DOIs
出版狀態Published - 2017 十月 25
事件1st International Conference on Composite Material, Polymer Science and Engineering, CMPSE 2017 - Toyama, Japan
持續時間: 2017 六月 242017 六月 25

All Science Journal Classification (ASJC) codes

  • 化學 (全部)
  • 材料科學(全部)
  • 工程 (全部)

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