Residual-layer-free direct printing by selective filling of a mould

Yu Chih Kao, Franklin Chau Nan Hong

研究成果: Article同行評審

4 引文 斯高帕斯(Scopus)

摘要

We have developed a residual-layer-free patterning method by selectively filling the concavity of a mould with liquid solution. The method has potential for large-area roll-to-roll fabrication of micro-devices on the flexible substrates. By choosing an appropriate solution or liquid, such as polymethylmethacrylate (PMMA) solution or epoxy precursor, with suitable dynamic contact angle on the SAM-treated mould, the liquid can be coated on the concavity of the mould only. By using this method, residual-layer-free epoxy pattern could be achieved without the need of an extra step. Without forming a residual layer, the technology could simplify the fabrication of three-dimensional structures with low distortion and smooth edges. Conductive PPy/PMMA patterns can also be fabricated by selective deposition of PMMA/FeCl3 and then exposing to pyrrole/chlorobenzene vapours to induce chemical oxidative polymerization of PPy. The electrical resistivity of PPy/PMMA obtained was 0.17 Ω cm.

原文English
文章編號025026
期刊Journal of Micromechanics and Microengineering
21
發行號2
DOIs
出版狀態Published - 2011 二月 1

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Mechanics of Materials
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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