Revisit the electromigration effect: In situ synchrotron X-ray and scanning electron microscopy and ab initio calculations

Shih Kang Lin, Yu Chen Liu, Shang Jui Chiu, Yen Ting Liu, Hsin Yi Lee

研究成果: Conference contribution

摘要

The electromigration (EM) effect has been known to be atomic diffusion due to unbalanced electrostatic and electron-wind forces exerted on metal ions. Recent theoretical model on the mechanism were focused on the kinetics point of view. However, none of these models has coupled the EM effect and lattice stability. In this work, in situ current stressing experiments using synchrotron X-ray diffractometry and scanning electron microscopy with ab initio calculations based on density functional theory were performed for pure Cu strips. A new and novel mechanism of EM effect is revealed in this study, which enables the developments on new design rule for fine-pitch and high-power packaging.

原文English
主出版物標題2017 International Conference on Electronics Packaging, ICEP 2017
發行者Institute of Electrical and Electronics Engineers Inc.
頁面517-518
頁數2
ISBN(電子)9784990218836
DOIs
出版狀態Published - 2017 六月 5
事件2017 International Conference on Electronics Packaging, ICEP 2017 - Tendo, Yamagata, Japan
持續時間: 2017 四月 192017 四月 22

出版系列

名字2017 International Conference on Electronics Packaging, ICEP 2017

Other

Other2017 International Conference on Electronics Packaging, ICEP 2017
國家/地區Japan
城市Tendo, Yamagata
期間17-04-1917-04-22

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程
  • 工業與製造工程
  • 電子、光磁材料

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