Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

Jenn Ming Song; Pei Chi Liu; Chia Ling Shih; Kwang Lung Lin

doi:10.1007/s11664-005-0270-7

Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

Jenn Ming Song, Pei Chi Liu, Chia Ling Shih, Kwang Lung Lin

研究成果: Article › 同行評審

43 引文斯高帕斯（Scopus）

摘要

This study explored the effect of Ag as the substrate or alloying element of solders on the interfacial reaction in Sn-Zn soldering. Results show that instead of Ag-Sn compounds, ζ-AgZn and γ-Ag₅Zn₈ form at the Sn-Zn/Ag interface. The addition of Ag in Sn-Zn solders leads to the precipitation of ε-AgZn₃ from the liquid solder on preformed interfacial intermetallics. The morphology of this additional AgZn₃ is closely related to the solidification process of Ag-Zn intermetallics and the under intermetallic layer.

原文	English
頁（從 - 到）	1249-1254
頁數	6
期刊	Journal of Electronic Materials
卷	34
發行號	9
DOIs	https://doi.org/10.1007/s11664-005-0270-7
出版狀態	Published - 2005 九月

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Electrical and Electronic Engineering
Materials Chemistry

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10.1007/s11664-005-0270-7

指紋深入研究「Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering」主題。共同形成了獨特的指紋。

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