Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

Jenn Ming Song; Pei Chi Liu; Chia Ling Shih; Kwang Lung Lin

doi:10.1007/s11664-005-0270-7

Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

Jenn Ming Song, Pei Chi Liu, Chia Ling Shih, Kwang Lung Lin

研究成果: Article › 同行評審

46 引文斯高帕斯（Scopus）

摘要

This study explored the effect of Ag as the substrate or alloying element of solders on the interfacial reaction in Sn-Zn soldering. Results show that instead of Ag-Sn compounds, ζ-AgZn and γ-Ag₅Zn₈ form at the Sn-Zn/Ag interface. The addition of Ag in Sn-Zn solders leads to the precipitation of ε-AgZn₃ from the liquid solder on preformed interfacial intermetallics. The morphology of this additional AgZn₃ is closely related to the solidification process of Ag-Zn intermetallics and the under intermetallic layer.

原文	English
頁（從 - 到）	1249-1254
頁數	6
期刊	Journal of Electronic Materials
卷	34
發行號	9
DOIs	https://doi.org/10.1007/s11664-005-0270-7
出版狀態	Published - 2005 9月

All Science Journal Classification (ASJC) codes

電子、光磁材料
凝聚態物理學
電氣與電子工程
材料化學

存取文件

10.1007/s11664-005-0270-7

其它文件與鏈接

引用此

@article{e5dcc3ad22ed429fa8209cf50f2f26aa,

title = "Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering",

abstract = "This study explored the effect of Ag as the substrate or alloying element of solders on the interfacial reaction in Sn-Zn soldering. Results show that instead of Ag-Sn compounds, ζ-AgZn and γ-Ag5Zn8 form at the Sn-Zn/Ag interface. The addition of Ag in Sn-Zn solders leads to the precipitation of ε-AgZn3 from the liquid solder on preformed interfacial intermetallics. The morphology of this additional AgZn3 is closely related to the solidification process of Ag-Zn intermetallics and the under intermetallic layer.",

author = "Song, {Jenn Ming} and Liu, {Pei Chi} and Shih, {Chia Ling} and Lin, {Kwang Lung}",

note = "Funding Information: The authors acknowledge the financial support from the National Science Council of the Republic of China under Grant No. NSC 93-2216-E-006-010.",

year = "2005",

month = sep,

doi = "10.1007/s11664-005-0270-7",

language = "English",

volume = "34",

pages = "1249--1254",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "9",

}

TY - JOUR

T1 - Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

AU - Song, Jenn Ming

AU - Liu, Pei Chi

AU - Shih, Chia Ling

AU - Lin, Kwang Lung

N1 - Funding Information: The authors acknowledge the financial support from the National Science Council of the Republic of China under Grant No. NSC 93-2216-E-006-010.

PY - 2005/9

Y1 - 2005/9

N2 - This study explored the effect of Ag as the substrate or alloying element of solders on the interfacial reaction in Sn-Zn soldering. Results show that instead of Ag-Sn compounds, ζ-AgZn and γ-Ag5Zn8 form at the Sn-Zn/Ag interface. The addition of Ag in Sn-Zn solders leads to the precipitation of ε-AgZn3 from the liquid solder on preformed interfacial intermetallics. The morphology of this additional AgZn3 is closely related to the solidification process of Ag-Zn intermetallics and the under intermetallic layer.

AB - This study explored the effect of Ag as the substrate or alloying element of solders on the interfacial reaction in Sn-Zn soldering. Results show that instead of Ag-Sn compounds, ζ-AgZn and γ-Ag5Zn8 form at the Sn-Zn/Ag interface. The addition of Ag in Sn-Zn solders leads to the precipitation of ε-AgZn3 from the liquid solder on preformed interfacial intermetallics. The morphology of this additional AgZn3 is closely related to the solidification process of Ag-Zn intermetallics and the under intermetallic layer.

UR - http://www.scopus.com/inward/record.url?scp=25444439340&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=25444439340&partnerID=8YFLogxK

U2 - 10.1007/s11664-005-0270-7

DO - 10.1007/s11664-005-0270-7

M3 - Article

AN - SCOPUS:25444439340

VL - 34

SP - 1249

EP - 1254

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

SN - 0361-5235

IS - 9

ER -

Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

摘要

All Science Journal Classification (ASJC) codes

存取文件

其它文件與鏈接

指紋

引用此