Role of Ag in the formation of interfacial intermetallic phases in Sn-Zn soldering

Jenn Ming Song, Pei Chi Liu, Chia Ling Shih, Kwang Lung Lin

研究成果: Article同行評審

46 引文 斯高帕斯(Scopus)

摘要

This study explored the effect of Ag as the substrate or alloying element of solders on the interfacial reaction in Sn-Zn soldering. Results show that instead of Ag-Sn compounds, ζ-AgZn and γ-Ag5Zn8 form at the Sn-Zn/Ag interface. The addition of Ag in Sn-Zn solders leads to the precipitation of ε-AgZn3 from the liquid solder on preformed interfacial intermetallics. The morphology of this additional AgZn3 is closely related to the solidification process of Ag-Zn intermetallics and the under intermetallic layer.

原文English
頁(從 - 到)1249-1254
頁數6
期刊Journal of Electronic Materials
34
發行號9
DOIs
出版狀態Published - 2005 9月

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 凝聚態物理學
  • 電氣與電子工程
  • 材料化學

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