Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit?

Chun Han Chen, Bing-Hung Chen, L. Hong

研究成果: Article

36 引文 (Scopus)

摘要

The effect of cupric (Cu2+) ion as an additive in the acidic electroless nickel plating (ENP) bath on the characteristics of the resulting nickel-phosphorus (Ni-P) alloys was investigated mainly with X-ray diffraction, scanning electron microscopy, and energy-dispersive X-ray (EDX) spectrometry. Cupric ions in the acidic ENP bath using hypophosphite anions as reductants have been reported ambiguously as stabilizers or codeposit constituents. In this work, the critical concentration of added copper salts, CuSO 4·5H2O, that starts to inhibit the ENP process was determined to be ca. 536 mg/L. In general, the deposition rate, surface morphology, and pit formation on the surface of as-deposits are significantly improved with Cu2+ addition at concentrations less than the critical value. The electroless nickel alloys were shown as a mixture of an amorphous deposit and a crystalline copper metal rather than as amorphous alloys alone.1,2 During the initial stage of the electroless plating process, the copper contents in as-deposits were found to decrease rapidly with plating time from the EDX analyses. The X-ray photoelectron spectroscopy result also confirms that copper is the preferred deposited species during the initial stage of the ENP process. The theoretical model3 is revised by taking into account the effect of adsorbed cupric ions on the shift in the depth of the net nuclear potential of the electroless nickel frontier, and successfully predicts the deposition rates. Moreover, as predicted by the revised model, the adsorbed cupric ions on the just-deposited Ni-Cu-P frontier could enhance the adsorption of hypophosphite anions and, accordingly, the deposition rates.

原文English
頁(從 - 到)2959-2968
頁數10
期刊Chemistry of Materials
18
發行號13
DOIs
出版狀態Published - 2006 六月 27

指紋

Electroless plating
Nickel plating
Nickel
Plating
Phosphorus
Copper
Deposition rates
Ions
Deposits
Anions
Negative ions
Reducing Agents
Nickel alloys
Amorphous alloys
Surface morphology
X ray photoelectron spectroscopy
Salts
Metals
Crystalline materials
Adsorption

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Chemical Engineering(all)
  • Materials Chemistry

引用此文

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Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system : A stabilizer or a codeposit? / Chen, Chun Han; Chen, Bing-Hung; Hong, L.

於: Chemistry of Materials, 卷 18, 編號 13, 27.06.2006, p. 2959-2968.

研究成果: Article

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