Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit?

Chun Han Chen, Bing-Hung Chen, L. Hong

研究成果: Article同行評審

39 引文 斯高帕斯(Scopus)

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深入研究「Role of Cu<sup>2+</sup> as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit?」主題。共同形成了獨特的指紋。

Engineering & Materials Science

Chemical Compounds