Sensitivity analysis for the junction temperature measurement of the LED 12

Yeun Ming Tzou, Wei Keng Lin, Bo Ruei Chen, Paul Wang

研究成果: Conference contribution

摘要

LED have the special character that LED break out radiant power and heat when it is operating. Recently photo efficiency of LED is just 20% and almost residual power converts heat. But heat causes bad reliability and changes of electrical and optical character negatively. Therefore, the LED package design is the first issue for the solution of the heat problem. This study was to design a LED T-junction measurement platform which based on the required of JEDEC-51-1. The experiment results include four parts: (1) Manually retrieve V Fss voltage, the temperature raised around 3∼5°C between the chip junction temperature and LED pin; (2) Automatically retrieve V Fss voltage, the temperature raised around 30∼50°C for the same condition; (3) From trend of T J vs. time, the definition of the steady state require at least 900 sec, but we would suggest 1200 sec in this study; (4) There is no significant difference of the T J for the retrieval time 100 μs and 10μs. The important achievement of the results of this experiment can be used as a reference for T J measurement.

原文English
主出版物標題Electrical Power and Energy Systems
頁面425-432
頁數8
DOIs
出版狀態Published - 2012
事件1st International Conference on Energy and Environmental Protection, ICEEP 2012 - Hohhot, China
持續時間: 2012 六月 232012 六月 24

出版系列

名字Advanced Materials Research
516-517
ISSN(列印)1022-6680

Other

Other1st International Conference on Energy and Environmental Protection, ICEEP 2012
國家/地區China
城市Hohhot
期間12-06-2312-06-24

All Science Journal Classification (ASJC) codes

  • 工程 (全部)

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