Silicon strength testing for mesoscale structural applications

Kuo Shen Chen, Arturo A. Ayon, S. Mark Spearing

研究成果: Conference article同行評審

5 引文 斯高帕斯(Scopus)

摘要

Strength characterization and supporting analysis of mesoscale biaxial flexure and radiused hub flexure single crystal silicon specimens were conducted. The Weibull reference strength of planar biaxial flexure specimens was found to lie in the range 1.2 to 4.6 GPa. The local strength at stress concentrations was obtained by testing radiused hub flexure specimens. For the case of deep reactive ion etched (DRIE) specimens, the strength at fillet radii was significantly lower than that measured from planar biaxial flexure specimens due to the inferior surface quality in such regions. Further, it was found that strength could be significantly increased by the introduction of an additional isotropic etch after the DRIE step.

原文English
頁(從 - 到)123-130
頁數8
期刊Materials Research Society Symposium - Proceedings
518
DOIs
出版狀態Published - 1998
事件Proceedings of the 1998 MRS Spring Symposium - San Francisco, CA, USA
持續時間: 1998 四月 151998 四月 16

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 凝聚態物理學
  • 材料力學
  • 機械工業

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