TY - JOUR
T1 - Silicon strength testing for mesoscale structural applications
AU - Chen, Kuo Shen
AU - Ayon, Arturo A.
AU - Spearing, S. Mark
PY - 1998
Y1 - 1998
N2 - Strength characterization and supporting analysis of mesoscale biaxial flexure and radiused hub flexure single crystal silicon specimens were conducted. The Weibull reference strength of planar biaxial flexure specimens was found to lie in the range 1.2 to 4.6 GPa. The local strength at stress concentrations was obtained by testing radiused hub flexure specimens. For the case of deep reactive ion etched (DRIE) specimens, the strength at fillet radii was significantly lower than that measured from planar biaxial flexure specimens due to the inferior surface quality in such regions. Further, it was found that strength could be significantly increased by the introduction of an additional isotropic etch after the DRIE step.
AB - Strength characterization and supporting analysis of mesoscale biaxial flexure and radiused hub flexure single crystal silicon specimens were conducted. The Weibull reference strength of planar biaxial flexure specimens was found to lie in the range 1.2 to 4.6 GPa. The local strength at stress concentrations was obtained by testing radiused hub flexure specimens. For the case of deep reactive ion etched (DRIE) specimens, the strength at fillet radii was significantly lower than that measured from planar biaxial flexure specimens due to the inferior surface quality in such regions. Further, it was found that strength could be significantly increased by the introduction of an additional isotropic etch after the DRIE step.
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U2 - 10.1557/proc-518-123
DO - 10.1557/proc-518-123
M3 - Conference article
AN - SCOPUS:0032291693
SN - 0272-9172
VL - 518
SP - 123
EP - 130
JO - Materials Research Society Symposium - Proceedings
JF - Materials Research Society Symposium - Proceedings
T2 - Proceedings of the 1998 MRS Spring Symposium
Y2 - 15 April 1998 through 16 April 1998
ER -