Silver end termination paste preparation for chip inductor applications

Hsing I. Hsiang, Liang Fang Fan, Hao Yin Cheng

研究成果: Article同行評審

5 引文 斯高帕斯(Scopus)

摘要

A silver end termination paste fired at low temperature (600-650°C) for chip inductor applications is developed in this work. The lead-free glass chemical composition and glass content in the silver paste effects on the densification, microstructure and interfacial reaction between the end termination and NiCuZn ferrites were investigated using scanning electron microscopy, electron probe microanalysis, X-ray diffractometer and dilatometer. The results show that nearly complete densification can be obtained for the paste added with 40 wt% B2O3 glass. Optimal glass Bi2O3 content (about 6.5 wt%) and glass content (about 15 wt%) are helpful in promoting adhesion strength due to interfacial reaction enhancement between the glass in the paste and NiCuZn ferrites.

原文English
頁(從 - 到)835-843
頁數9
期刊Journal of Alloys and Compounds
650
DOIs
出版狀態Published - 2015 八月 22

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

指紋 深入研究「Silver end termination paste preparation for chip inductor applications」主題。共同形成了獨特的指紋。

引用此