TY - JOUR
T1 - Sintering Nano-Silver Paste by Resistive Joule Heating Process for 2G HTS Tape Joints
AU - Yang, Chia Ming
AU - Chang, Yu Chuan
AU - Chang, Chi Lei
AU - Chen, In Gann
N1 - Funding Information:
Funding: This research was founded by Ministry of Science and Technology of Taiwan, grant number MOST 108-2633-M-001-001 and MOST 109-2639-M-001-001.
Publisher Copyright:
© 2022 by the authors. Licensee MDPI, Basel, Switzerland.
PY - 2022/2/1
Y1 - 2022/2/1
N2 - Developing a joining technology for 2G HTS tapes without significantly reducing their superconducting property is crucial for numerous applications (MRI, motor/generator, power trans-mission, etc.). In this study, low sintering temperature (~230◦C) nano-silver paste was used as solder to join two 2G HTS tapes. In addition, two heating methods, i.e., furnace heating (heat flux outside-in) and resistive Joule heating (heat flux inside-out), were studied. This study indicates that the heat flux from internal by resistive Joule heating method shows less deteriorating impact to the 2G RE-Ba-Cu-O tape (RE: rare earth element) during the sintering process with the best specific resistance of 0.074 µΩ·cm2 and Ic retention percentage of 99% (i.e., Ic reduced from 100 A before joining to 99 A after joining). This study indicates that nano-silver paste together with resistive Joule heating can possibly be used as soldering materials to join 2G HTS tapes.
AB - Developing a joining technology for 2G HTS tapes without significantly reducing their superconducting property is crucial for numerous applications (MRI, motor/generator, power trans-mission, etc.). In this study, low sintering temperature (~230◦C) nano-silver paste was used as solder to join two 2G HTS tapes. In addition, two heating methods, i.e., furnace heating (heat flux outside-in) and resistive Joule heating (heat flux inside-out), were studied. This study indicates that the heat flux from internal by resistive Joule heating method shows less deteriorating impact to the 2G RE-Ba-Cu-O tape (RE: rare earth element) during the sintering process with the best specific resistance of 0.074 µΩ·cm2 and Ic retention percentage of 99% (i.e., Ic reduced from 100 A before joining to 99 A after joining). This study indicates that nano-silver paste together with resistive Joule heating can possibly be used as soldering materials to join 2G HTS tapes.
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U2 - 10.3390/ma15041571
DO - 10.3390/ma15041571
M3 - Article
AN - SCOPUS:85125173046
VL - 15
JO - Materials
JF - Materials
SN - 1996-1944
IS - 4
M1 - 1571
ER -