Size reduction and dual mode degeneracy in microstrip patch antenna using periodically rippled silicon substrate

Mohsen Yazdani, Aryan Navabi, Pedram Khalili, Kang Wang

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

A novel fabrication process for periodically rippled transmission lines is presented in this paper. This technique allows for height modulation of microstrip passive components, resulting in size reduction as well as dual mode degeneracy. A 4 mm × 4 mm X-band one dimensional (1D) rippled patch antenna with 6 μm periodicity is designed and fabricated using this technique. A 26% size reduction compared to regular antennas, as well as dual-mode operation is demonstrated in measurements. The measurement results confirm the potential application of the proposed structure in the design of compact dual-band integrated devices on silicon substrates.

原文English
主出版物標題2015 IEEE MTT-S International Microwave Symposium, IMS 2015
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781479982752
DOIs
出版狀態Published - 2015 七月 24
事件IEEE MTT-S International Microwave Symposium, IMS 2015 - Phoenix, United States
持續時間: 2015 五月 172015 五月 22

出版系列

名字2015 IEEE MTT-S International Microwave Symposium, IMS 2015

Other

OtherIEEE MTT-S International Microwave Symposium, IMS 2015
國家United States
城市Phoenix
期間15-05-1715-05-22

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Signal Processing
  • Electrical and Electronic Engineering

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