Solution growth of Cu2S nanowalls on Cu substrates and their characterization

Yung Tang Nien, Yu Hsuan Chang, In Gann Chen

研究成果: Article同行評審

5 引文 斯高帕斯(Scopus)

摘要

A simple method of preparing Cu2S nanowalls was presented by immersing Cu substrates into a Na2S/HCl solution. X-ray diffraction (XRD) analysis revealed the formation of the monoclinic phase of Cu2S nanostructures on Cu substrates, presenting a thickness of less than 100 nm and a height of several micrometers (called nanowalls) from the scanning electron microscopic (SEM) images. Moreover, the transmission electron microscopy (TEM) and X-ray energy dispersive spectrometry (EDS) characterizations indicated that these Cu2S nanowalls were thinner near the sheet edge and had voids inside the sheets supposedly due to the etching reaction by Na2S/HCl. Cu substrates with Cu2S nanowalls were found to exhibit extinguished hydrophobicity (> 110°) resulting from their rough surfaces based on the water contact angle measurements. Electrical current-voltage analysis indicated the formation of a Schottky barrier at the Cu2S/Cu interface.

原文English
頁(從 - 到)1201-1203
頁數3
期刊Materials Letters
65
發行號8
DOIs
出版狀態Published - 2011 四月 30

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 凝聚態物理學
  • 材料力學
  • 機械工業

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