TY - JOUR
T1 - Static analysis of the die picking process
AU - Lin, Yeong Jyh
AU - Hwang, Sheng Jye
N1 - Funding Information:
Manuscript received June 13, 2004; revised September 21, 2004. This work was supported by Gallant Precision Machining Co. Ltd., Hsinchu, Taiwan, R.O.C. The authors are with the Department of Mechanical Engineering, National Cheng Kung University, Tainan, Taiwan, R.O.C. (e-mail: [email protected]; [email protected]). Digital Object Identifier 10.1109/TEPM.2005.847396
PY - 2005/4
Y1 - 2005/4
N2 - A numerical procedure was applied to simulate the pickup process for a die bonder to study the breakage of GaAs dice. Parameters such as needle ejecting speed, vacuum pressure, and radius of needle were investigated by the Taguchi method to obtain the manufacture process working-window in order to shorten the tuning time. It was found that the ejecting speed of the needle and the downward pressing force of the pickup collet are the major factors for die breakage. This procedure could also be applied to inspecting the effects of other factors or analyzing different types of pickup machines.
AB - A numerical procedure was applied to simulate the pickup process for a die bonder to study the breakage of GaAs dice. Parameters such as needle ejecting speed, vacuum pressure, and radius of needle were investigated by the Taguchi method to obtain the manufacture process working-window in order to shorten the tuning time. It was found that the ejecting speed of the needle and the downward pressing force of the pickup collet are the major factors for die breakage. This procedure could also be applied to inspecting the effects of other factors or analyzing different types of pickup machines.
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U2 - 10.1109/TEPM.2005.847396
DO - 10.1109/TEPM.2005.847396
M3 - Article
AN - SCOPUS:21244436074
SN - 1521-334X
VL - 28
SP - 142
EP - 149
JO - IEEE Transactions on Electronics Packaging Manufacturing
JF - IEEE Transactions on Electronics Packaging Manufacturing
IS - 2
ER -