摘要
The statistical variation of NMOSFET hot-carrier lifetime is studied. The variation in lifetime among spatially separate dies is more significant than the variation within each die. Due to the statistical nature of device hot-carrier lifetime, hot-carrier induced circuit delay degradation in critical paths is a statistical distribution rather than a deterministic parameter. A statistical hot-carrier simulator has been developed to predict the impact that statistical variation of device hot-carrier lifetime has on circuit reliability.
原文 | English |
---|---|
頁(從 - 到) | 29-32 |
頁數 | 4 |
期刊 | Technical Digest - International Electron Devices Meeting |
出版狀態 | Published - 1995 |
事件 | Proceedings of the 1995 International Electron Devices Meeting, IEDM'95 - Washington, DC, USA 持續時間: 1995 12月 10 → 1995 12月 13 |
All Science Journal Classification (ASJC) codes
- 電子、光磁材料
- 凝聚態物理學
- 電氣與電子工程
- 材料化學