Strengthening in a copper composite containing graphene nanofillers

Y. Song, W. W. Liu, Y. Chen

研究成果: Conference article同行評審

摘要

Multi-layer graphenes (MLGs) reinforced Cu matrix composites were fabricated using spark plasma sintering in this research. Microstructure observation indicated that MLGs homogeneously disperse in the matrix to result in grain refinement. Instrumented spherical micro-indentation tests were conducted to evaluate micro-mechanical properties of the composites, and the elastic modulus and indentation yield strength of the 1.5 wt.% MLG/Cu composite increase up to ∼ 36% and ∼ 41% than those of the unreinforced Cu, respectively. Grain refinement, the enhanced dislocation density (EDD) due to the thermal expansion mismatch between Cu matrix and MLGs and Orowan are thought to be the main strengthening mechanisms in this research.

原文English
文章編號012017
期刊IOP Conference Series: Materials Science and Engineering
170
發行號1
DOIs
出版狀態Published - 2017 二月 17
事件3rd International Conference on Advanced Materials Research and Applications, AMRA 2016 - Guangzhou, China
持續時間: 2016 十二月 182016 十二月 21

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Engineering(all)

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