Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones

Yun Che Wang; Jun Liang Chen; Ming Liang Liao; Chuan Chen; Yan Chi Chen; Chi Chuan Hwang

doi:10.1115/MNHMT2009-18379

Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones

Yun Che Wang, Jun Liang Chen, Ming Liang Liao, Chuan Chen, Yan Chi Chen, Chi Chuan Hwang

研究成果: Conference contribution

摘要

It has been shown that nanotubes and nanocones are most effective to make indents with large aspect ratios,. Detailed studies in the heat transfer processes under the nano-scale indentation, and the accompanying stress distributions are required much attention. In this study, the copper substrate was indented with a nanotube or nano-cone. It is found that nano-cones may make indents with larger aspect ratios than the nanotubes due to the local shell buckling. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. The effect of temperatures and stresses on the changes of the microstructures of the substrate will be discussed.

原文	English
主出版物標題	Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
頁面	587-589
頁數	3
DOIs	https://doi.org/10.1115/MNHMT2009-18379
出版狀態	Published - 2010 7月 12
事件	ASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009 - Shanghai, China 持續時間: 2009 12月 18 → 2009 12月 21

出版系列

名字	Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
卷	2

Other

Other	ASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009
國家/地區	China
城市	Shanghai
期間	09-12-18 → 09-12-21

All Science Journal Classification (ASJC) codes

流體流動和轉移過程

存取文件

10.1115/MNHMT2009-18379

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引用此

Wang, Y. C., Chen, J. L., Liao, M. L., Chen, C., Chen, Y. C., & Hwang, C. C. (2010). Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones. 於 Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009 (頁 587-589). (Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009; 卷 2). https://doi.org/10.1115/MNHMT2009-18379

Wang, Yun Che ; Chen, Jun Liang ; Liao, Ming Liang 等. / Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones. Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009. 2010. 頁 587-589 (Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009).

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title = "Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones",

abstract = "It has been shown that nanotubes and nanocones are most effective to make indents with large aspect ratios,. Detailed studies in the heat transfer processes under the nano-scale indentation, and the accompanying stress distributions are required much attention. In this study, the copper substrate was indented with a nanotube or nano-cone. It is found that nano-cones may make indents with larger aspect ratios than the nanotubes due to the local shell buckling. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. The effect of temperatures and stresses on the changes of the microstructures of the substrate will be discussed.",

author = "Wang, {Yun Che} and Chen, {Jun Liang} and Liao, {Ming Liang} and Chuan Chen and Chen, {Yan Chi} and Hwang, {Chi Chuan}",

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pages = "587--589",

booktitle = "Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009",

note = "ASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009 ; Conference date: 18-12-2009 Through 21-12-2009",

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Wang, YC, Chen, JL, Liao, ML, Chen, C, Chen, YC & Hwang, CC 2010, Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones. 於 Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009. Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009, 卷 2, 頁 587-589, ASME 2009 Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009, Shanghai, China, 09-12-18. https://doi.org/10.1115/MNHMT2009-18379

Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones. / Wang, Yun Che; Chen, Jun Liang; Liao, Ming Liang 等.
Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009. 2010. p. 587-589 (Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009; 卷 2).

研究成果: Conference contribution

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AU - Wang, Yun Che

AU - Chen, Jun Liang

AU - Liao, Ming Liang

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AU - Chen, Yan Chi

AU - Hwang, Chi Chuan

PY - 2010/7/12

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N2 - It has been shown that nanotubes and nanocones are most effective to make indents with large aspect ratios,. Detailed studies in the heat transfer processes under the nano-scale indentation, and the accompanying stress distributions are required much attention. In this study, the copper substrate was indented with a nanotube or nano-cone. It is found that nano-cones may make indents with larger aspect ratios than the nanotubes due to the local shell buckling. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. The effect of temperatures and stresses on the changes of the microstructures of the substrate will be discussed.

AB - It has been shown that nanotubes and nanocones are most effective to make indents with large aspect ratios,. Detailed studies in the heat transfer processes under the nano-scale indentation, and the accompanying stress distributions are required much attention. In this study, the copper substrate was indented with a nanotube or nano-cone. It is found that nano-cones may make indents with larger aspect ratios than the nanotubes due to the local shell buckling. Time-domain heat transfer and stress analysis was carried out by using a control-volume technique with an atomic spatial resolution, except near the boundaries. The effect of temperatures and stresses on the changes of the microstructures of the substrate will be discussed.

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Wang YC, Chen JL, Liao ML, Chen C, Chen YC, Hwang CC. Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones. 於 Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009. 2010. p. 587-589. (Proceedings of the ASME Micro/Nanoscale Heat and Mass Transfer International Conference 2009, MNHMT2009). doi: 10.1115/MNHMT2009-18379

Stress and temperature analysis of the copper substrate indented with nanotubes and nanocones

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