Stress intensity factors of interface corners

Chyanbin Hwu, T. L. Kuo

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

Stress singularity usually occurs near the interface corners, which may initiate failure of structures. Although several detailed studies have been done about the determination of their associated singular orders and stress intensity factors, very few failure criteria for general interface corners were successfully established based upon these parameters. Even the cracks in homogeneous media or the cracks lying along the interface between dissimilar materials are the special cases of the interface corners, the definitions of stress intensity factors proposed in the literature are usually not consistent with that of cracks. Thus, to have a universal failure criterion for the homogeneous cracks, interface cracks and interface corners, a unified definition for the stress intensity factors is indispensable. Moreover, according to the experience of crack problems, finding a stable and accurate approach to calculate the stress intensity factors is also important. Based upon the analytical solutions obtained previously for the multibonded anisotropic wedges and the well-known path-independent H-integral, in this paper we provide a unified definition and a stable computing approach for the stress intensity factors of interface corners.

原文English
主出版物標題Proceedings - EMAP 2005
主出版物子標題2005 International Symposium on Electronics Materials and Packaging
頁面252-257
頁數6
DOIs
出版狀態Published - 2005 十二月 1
事件EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging - Tokyo, Japan
持續時間: 2005 十二月 112005 十二月 14

出版系列

名字Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
2005

Other

OtherEMAP 2005: 2005 International Symposium on Electronics Materials and Packaging
國家Japan
城市Tokyo
期間05-12-1105-12-14

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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