Studies of Interfacial Microstructures and Series Resistance on Electroplated and Hot-Dipped Sn-xCu Photovoltaic Modules

Kuan Jen Chen, Fei Yi Hung, Truan Sheng Lui, Lin Hsu

研究成果: Article同行評審

6 引文 斯高帕斯(Scopus)

摘要

The present study applied molten Sn-xCu (x = 0.3, 0.7, 2.5, and 5.0 wt.%) alloy solders to a photovoltaic (PV) ribbon. A hot-dipped Sn-0.7Cu PV ribbon reflowed on a Si solar cell had the lowest series resistance of the tested module (Cu/Solder/Ag). After biasing for 72 h, the rapid growth of intermetallic compounds (IMCs) (Cu6Sn5, Ag3Sn) caused the series resistance of the module to increase by 52%. To improve the performance of the PV module, an electroplated PV ribbon was used in place of the hot-dipped one. The required solder thickness for the electroplated ribbon was one third that for hot-dipped ribbon. Applying less solder to a PV ribbon avoids the overgrowth of IMCs and thus enhances module conductivity.

原文English
頁(從 - 到)6028-6035
頁數8
期刊Journal of Electronic Materials
47
發行號10
DOIs
出版狀態Published - 2018 十月 1

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 凝聚態物理學
  • 電氣與電子工程
  • 材料化學

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