The present study applied molten Sn-xCu (x = 0.3, 0.7, 2.5, and 5.0 wt.%) alloy solders to a photovoltaic (PV) ribbon. A hot-dipped Sn-0.7Cu PV ribbon reflowed on a Si solar cell had the lowest series resistance of the tested module (Cu/Solder/Ag). After biasing for 72 h, the rapid growth of intermetallic compounds (IMCs) (Cu6Sn5, Ag3Sn) caused the series resistance of the module to increase by 52%. To improve the performance of the PV module, an electroplated PV ribbon was used in place of the hot-dipped one. The required solder thickness for the electroplated ribbon was one third that for hot-dipped ribbon. Applying less solder to a PV ribbon avoids the overgrowth of IMCs and thus enhances module conductivity.
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