Study of a compression-molding process for ultraviolet light-emitting diode exposure systems via finite-element analysis

Kuo Tsai Wu, Sheng Jye Hwang, Huei Huang Lee

研究成果: Article同行評審

摘要

Although wafer-level camera lenses are a very promising technology, problems such as warpage with time and non-uniform thickness of products still exist. In this study, finite element simulation was performed to simulate the compression molding process for acquiring the pressure distribution on the product on completion of the process and predicting the deformation with respect to the pressure distribution. Results show that the single-gate compression molding process significantly increases the pressure at the center of the product, whereas the multi-gate compressing molding process can effectively distribute the pressure. This study evaluated the non-uniform thickness of product and changes in the process parameters through computer simulations, which could help to improve the compression molding process.

原文English
文章編號1392
期刊Sensors (Switzerland)
17
發行號6
DOIs
出版狀態Published - 2017 六月 15

All Science Journal Classification (ASJC) codes

  • 分析化學
  • 生物化學
  • 原子與分子物理與光學
  • 儀器
  • 電氣與電子工程

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