Study of exposure uniformity of UV LED exposure system for wafer-level camera lenses

Kuo Tsai Wu, Sheng Jye Hwang, Huei Huang Lee

研究成果: Article同行評審

1 引文 斯高帕斯(Scopus)

摘要

Wafer-level camera lenses are a very promising process for camera lens fabrication. However, there exist some problems with this technology, such as uneven exposure due to curing non-uniformities. In this study, an optical simulation was implemented to simulate the UV light-emitting diodes (LEDs) curing process. We design the LED arrangement, and then find the corresponding LED and adjust the LED power to improve exposure uniformity. The simulation results are very close to the experimental data, and the uniformity is also within the standard range.

原文English
文章編號4110
期刊Applied Sciences (Switzerland)
9
發行號19
DOIs
出版狀態Published - 2019 10月 1

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 儀器
  • 工程 (全部)
  • 製程化學與技術
  • 電腦科學應用
  • 流體流動和轉移過程

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