摘要
Wafer-level camera lenses are a very promising process for camera lens fabrication. However, there exist some problems with this technology, such as uneven exposure due to curing non-uniformities. In this study, an optical simulation was implemented to simulate the UV light-emitting diodes (LEDs) curing process. We design the LED arrangement, and then find the corresponding LED and adjust the LED power to improve exposure uniformity. The simulation results are very close to the experimental data, and the uniformity is also within the standard range.
原文 | English |
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文章編號 | 4110 |
期刊 | Applied Sciences (Switzerland) |
卷 | 9 |
發行號 | 19 |
DOIs | |
出版狀態 | Published - 2019 10月 1 |
All Science Journal Classification (ASJC) codes
- 一般材料科學
- 儀器
- 一般工程
- 製程化學與技術
- 電腦科學應用
- 流體流動和轉移過程