Study of interfacial phenomena affecting thermosonic wire bonding in microelectronics

Yeau Ren Jeng, Jeng Nan Lin

研究成果: Article同行評審

11 引文 斯高帕斯(Scopus)

指紋

深入研究「Study of interfacial phenomena affecting thermosonic wire bonding in microelectronics」主題。共同形成了獨特的指紋。

Chemical Compounds

Physics & Astronomy

Engineering & Materials Science