摘要
A two-plunger-type dilatometer was designed and fabricated to measure cure-induced volume changes of epoxy molding compound (EMC). The device is suitable for studying volume change of material systems that are fast reacting and with high conversions and high viscosity like commercial EMC. In this paper, the conversion rate was determined by DSC. Interactions of volume change, pressure, temperature, and conversion were measured. In the experiment, two different temperatures: 172°C, 180°C and four different pressures: 30, 50, 80, and 100 kgf/cm2 were applied. The total number of conditions in this experiment is 8. Volume change of EMC due to thermal expansion, cure shrinkage, and thermal contraction under fixed temperature and pressure was measured. For higher pressure, the final volume change will be higher.
| 原文 | English |
|---|---|
| 頁(從 - 到) | 371-373 |
| 頁數 | 3 |
| 期刊 | Journal of Electronic Packaging, Transactions of the ASME |
| 卷 | 124 |
| 發行號 | 4 |
| DOIs | |
| 出版狀態 | Published - 2002 12月 |
All Science Journal Classification (ASJC) codes
- 電子、光磁材料
- 材料力學
- 電腦科學應用
- 電氣與電子工程
指紋
深入研究「Study of P-V-T-C Relation of EMC」主題。共同形成了獨特的指紋。引用此
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