Study of the underfill effect on the Thermal fatigue life of wlcsp-experiments and finite element simulations

Shaw Jyh Shin, Chen Hung Huang, Y. C. Shiah

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

摘要

Owing to the CTE (Coefficient of Thermal Expansion) mismatch among solder joints, IC (Integrated Circuit) chip, and PCB (Printed Circuit Board), elec- tronic packages shall experience fatigue failure after going though a period of ther- mal cycling. As a major means to enhance the reliability of the solder joints, un- derfill is often dispensed to fill the gap between the die and the substrate. This study aims at investigating how the underfill may affect the thermal fatigue life of WLCSP (Wafer Level Chip Scale Package) by means of FEA (finite element analysis). In this study, the thermal fatigue life of the WLCSP was simulated us- ing full-model. For comparison with the FEA simulations, experiments were also conducted for a few WLCSP with/without underfill.

原文English
頁(從 - 到)83-103
頁數21
期刊CMES - Computer Modeling in Engineering and Sciences
40
發行號1
出版狀態Published - 2009 六月 18

All Science Journal Classification (ASJC) codes

  • 軟體
  • 建模與模擬
  • 電腦科學應用

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