Study of wire bonding reliability of Ag-Pd-Au alloy wire with flash-gold after chlorination and sulfidation

研究成果: Article

摘要

In this study, wire is made of nanometer flash-gold (Au) film deposited onto the surface of Ag-2.5 wt% Pd-1.5 wt% Au wire (APA wire), denoted as AAPA wire. The flash-Au film increases the resistance to chlorination and sulfidation of the silver (Ag) alloy wire, which is susceptible to deterioration in a chlorine- and sulfur-rich environment. In the chlorination test, the mechanical properties of the AAPA wire were better than those of the APA wire. Chloride ions corrode the wire along grain boundaries, resulting in a change from ductile fracture to brittle fracture in the tensile test. Chloride ions preferentially corroded the aluminum (Al) pad, greatly decreasing the reliability of the ball bond. The wedge bond did not fail due to the use of Au pad. In the sulfidation test, the average diameter of the wire increased with increasing sulfidation time. After sulfidation, the electrical conductivity decreased due to the thickening of Ag2S, whose resistance is high, and a decrease in the effective channel of the electric current. In addition, the formation of Ag2S caused a consumption of Ag atoms in the Ag wire, and thus formed voids at the interface between the sulfide layer and the Ag wire. The fracture of the sulfided ball bond was located in the heat-affected zone after the tensile test. The results show that the AAPA wire has better resistance in chlorination and sulfidation environment.

原文English
頁(從 - 到)186-196
頁數11
期刊Microelectronics Reliability
99
DOIs
出版狀態Published - 2019 八月 1

指紋

sulfidation
chlorination
Chlorination
Gold
flash
wire
Wire
gold
tensile tests
balls
Chlorides
chlorides
Ions
silver alloys
heat affected zone
Ductile fracture
Chlorine
Brittle fracture
high resistance
Electric currents

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Condensed Matter Physics
  • Safety, Risk, Reliability and Quality
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

引用此文

@article{207b4fec12ad4dc0ab18f11d291736fd,
title = "Study of wire bonding reliability of Ag-Pd-Au alloy wire with flash-gold after chlorination and sulfidation",
abstract = "In this study, wire is made of nanometer flash-gold (Au) film deposited onto the surface of Ag-2.5 wt{\%} Pd-1.5 wt{\%} Au wire (APA wire), denoted as AAPA wire. The flash-Au film increases the resistance to chlorination and sulfidation of the silver (Ag) alloy wire, which is susceptible to deterioration in a chlorine- and sulfur-rich environment. In the chlorination test, the mechanical properties of the AAPA wire were better than those of the APA wire. Chloride ions corrode the wire along grain boundaries, resulting in a change from ductile fracture to brittle fracture in the tensile test. Chloride ions preferentially corroded the aluminum (Al) pad, greatly decreasing the reliability of the ball bond. The wedge bond did not fail due to the use of Au pad. In the sulfidation test, the average diameter of the wire increased with increasing sulfidation time. After sulfidation, the electrical conductivity decreased due to the thickening of Ag2S, whose resistance is high, and a decrease in the effective channel of the electric current. In addition, the formation of Ag2S caused a consumption of Ag atoms in the Ag wire, and thus formed voids at the interface between the sulfide layer and the Ag wire. The fracture of the sulfided ball bond was located in the heat-affected zone after the tensile test. The results show that the AAPA wire has better resistance in chlorination and sulfidation environment.",
author = "Wu, {Yu Hsien} and Hung, {Fei Yi} and Lui, {Truan Sheng} and Chen, {Kuan Jen}",
year = "2019",
month = "8",
day = "1",
doi = "10.1016/j.microrel.2019.05.014",
language = "English",
volume = "99",
pages = "186--196",
journal = "Microelectronics Reliability",
issn = "0026-2714",
publisher = "Elsevier Limited",

}

TY - JOUR

T1 - Study of wire bonding reliability of Ag-Pd-Au alloy wire with flash-gold after chlorination and sulfidation

AU - Wu, Yu Hsien

AU - Hung, Fei Yi

AU - Lui, Truan Sheng

AU - Chen, Kuan Jen

PY - 2019/8/1

Y1 - 2019/8/1

N2 - In this study, wire is made of nanometer flash-gold (Au) film deposited onto the surface of Ag-2.5 wt% Pd-1.5 wt% Au wire (APA wire), denoted as AAPA wire. The flash-Au film increases the resistance to chlorination and sulfidation of the silver (Ag) alloy wire, which is susceptible to deterioration in a chlorine- and sulfur-rich environment. In the chlorination test, the mechanical properties of the AAPA wire were better than those of the APA wire. Chloride ions corrode the wire along grain boundaries, resulting in a change from ductile fracture to brittle fracture in the tensile test. Chloride ions preferentially corroded the aluminum (Al) pad, greatly decreasing the reliability of the ball bond. The wedge bond did not fail due to the use of Au pad. In the sulfidation test, the average diameter of the wire increased with increasing sulfidation time. After sulfidation, the electrical conductivity decreased due to the thickening of Ag2S, whose resistance is high, and a decrease in the effective channel of the electric current. In addition, the formation of Ag2S caused a consumption of Ag atoms in the Ag wire, and thus formed voids at the interface between the sulfide layer and the Ag wire. The fracture of the sulfided ball bond was located in the heat-affected zone after the tensile test. The results show that the AAPA wire has better resistance in chlorination and sulfidation environment.

AB - In this study, wire is made of nanometer flash-gold (Au) film deposited onto the surface of Ag-2.5 wt% Pd-1.5 wt% Au wire (APA wire), denoted as AAPA wire. The flash-Au film increases the resistance to chlorination and sulfidation of the silver (Ag) alloy wire, which is susceptible to deterioration in a chlorine- and sulfur-rich environment. In the chlorination test, the mechanical properties of the AAPA wire were better than those of the APA wire. Chloride ions corrode the wire along grain boundaries, resulting in a change from ductile fracture to brittle fracture in the tensile test. Chloride ions preferentially corroded the aluminum (Al) pad, greatly decreasing the reliability of the ball bond. The wedge bond did not fail due to the use of Au pad. In the sulfidation test, the average diameter of the wire increased with increasing sulfidation time. After sulfidation, the electrical conductivity decreased due to the thickening of Ag2S, whose resistance is high, and a decrease in the effective channel of the electric current. In addition, the formation of Ag2S caused a consumption of Ag atoms in the Ag wire, and thus formed voids at the interface between the sulfide layer and the Ag wire. The fracture of the sulfided ball bond was located in the heat-affected zone after the tensile test. The results show that the AAPA wire has better resistance in chlorination and sulfidation environment.

UR - http://www.scopus.com/inward/record.url?scp=85067525617&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85067525617&partnerID=8YFLogxK

U2 - 10.1016/j.microrel.2019.05.014

DO - 10.1016/j.microrel.2019.05.014

M3 - Article

AN - SCOPUS:85067525617

VL - 99

SP - 186

EP - 196

JO - Microelectronics Reliability

JF - Microelectronics Reliability

SN - 0026-2714

ER -