Study of wire bonding reliability of Ag-Pd-Au alloy wire with flash-gold after chlorination and sulfidation

Yu Hsien Wu, Fei Yi Hung, Truan Sheng Lui, Kuan Jen Chen

研究成果: Article同行評審

10 引文 斯高帕斯(Scopus)

指紋

深入研究「Study of wire bonding reliability of Ag-Pd-Au alloy wire with flash-gold after chlorination and sulfidation」主題。共同形成了獨特的指紋。

Physics & Astronomy

Engineering & Materials Science

Chemical Compounds