Study on electromigration effects and IMC formation on Cu–Sn films due to current stress and temperature

Zhao Ying Wang, Nhat Minh Dang, Po Hsun Wang, Terry Yuan Fang Chen, Ming Tzer Lin

研究成果: Article同行評審

摘要

In this study, the effects of electromigration on a solder/copper substrate due to temperature and current density stress were investigated. The copper–tin (Cu–Sn) film samples were subjected under a fixed current and various heating conditions (130 C and 180 C) and current densities (different cross-sectional areas). The micro-structural changes and intermetallic compound (IMC) formation were observed, and failure phenomena (brittle cracks, voids, bumps, etc.) on the structures of samples were discussed. The results showed that the IMC thickness increased as the temperature and current density increased. Moreover, it was found that the higher the temperature and current density was, the greater the defects that were observed. By adjusting the designs of sample structures, the stress from the current density can be decreased, resulting in reduced failure phenomena, such as signal delay, distortion, and short circuiting after long-term use of the material components. A detailed IMC growth mechanism and defect formation were also closely studied and discussed.

原文English
文章編號8893
頁(從 - 到)1-18
頁數18
期刊Applied Sciences (Switzerland)
10
發行號24
DOIs
出版狀態Published - 2020 十二月 2

All Science Journal Classification (ASJC) codes

  • 材料科學(全部)
  • 儀器
  • 工程 (全部)
  • 製程化學與技術
  • 電腦科學應用
  • 流體流動和轉移過程

指紋

深入研究「Study on electromigration effects and IMC formation on Cu–Sn films due to current stress and temperature」主題。共同形成了獨特的指紋。

引用此