Study on microstructure and shear strength of Sn-Ag-Sb solder joints

Hwa Teng Lee, Tain Long Liao, Ming Hung Chen

研究成果: Conference contribution

8 引文 斯高帕斯(Scopus)

摘要

This study investigates the microstructure, intermetallic compound (IMC) morphology and shear strength of Sn4.38Ag solder joints with different percentages of Sb content. The paper also evaluates, and compares, the thermal resistance of solder joints with different Sb content by means of high temperature storage testing. In order to achieve solder joints of the size found in the BGA package, this study used pure copper wires of 1 mm diameter as substrates for hot-dipping soldering. Solders with different compositions were selected for investigation, namely Sn4.38Ag, Sn3.9Ag0.9Sb, Sn4.4Ag1.44Sb and Sn4.11Ag1.86Sb, while a Sn40Pb solder was chosen for comparison purposes. High temperature storage testing was performed after soldering, with storage temperatures of 150°C and 200°C, respectively, and storage times of 0, 25, 100, 228 and 625 hours, respectively. Experimental results show that most of the Sb which is added to the solder is soluted in the β-Sn matrix, with the remainder reacting with the Sn and Ag atoms to form an ε-Ag3(Sn,Sb) compound.

原文English
主出版物標題Advances in Electronic Materials and Packaging 2001
編輯S.B. Lee, K.W. Paik
發行者Institute of Electrical and Electronics Engineers Inc.
頁面315-322
頁數8
ISBN(電子)0780371577, 9780780371576
DOIs
出版狀態Published - 2001 一月 1
事件3rd International Symposium on Electronic Materials and Packaging, EMAP 2001 - Jeju Island, Korea, Republic of
持續時間: 2001 十一月 192001 十一月 22

出版系列

名字Advances in Electronic Materials and Packaging 2001

Other

Other3rd International Symposium on Electronic Materials and Packaging, EMAP 2001
國家/地區Korea, Republic of
城市Jeju Island
期間01-11-1901-11-22

All Science Journal Classification (ASJC) codes

  • 電氣與電子工程
  • 電子、光磁材料

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