Wire sawing is the first machining process in prime wafer manufacturing. The performance of the wire sawing would affect subsequent grinding, lapping, and polishing processes. With the development of coating technology, the diamond-coated wire saw, also known as fixed abrasive diamond wire saw, is replacing the slurry wire saw in wafering, especially for very hard materials such as Sapphire and Silicon Carbide. The diamond-coated wire removes material as a fixed abrasive cutting tool, in which two-body abrasion is the major material removal mechanism as grinding. In grinding, Minimum Quantity Lubrication (MQL) has been studied and its performance showed the benefit to reduce the grinding force, working temperature, and surface roughness. However, the study of using MQL in diamond-coated wire sawing process is still absent. In this study, experiments of MQL in wire sawing process were conducted using customized desktop reciprocating wire saw machine. Three different lubricating conditions, Flood, Mist with a flow rate of 75 mL/hr, and Mist with a flow rate of 150 mL/ hr, were applied. In addition, the nanofluid with alumina nanoparticles were also employed in the MQL. The results show that the lubrication of the Mist with a flow rate of 150 mL/hr can reduce the slicing force efficiently. The tool wear and surface roughness of the three lubrication conditions are comparable. The addition of nano alumina particles in MQL can further reduce the cutting force. However, the nanoparticles increased the wear rate of diamond grains and degraded the performance of slicing after a period of usage.
|出版狀態||Published - 2017|
|事件||20th International Symposium on Advances in Abrasive Technology, ISAAT 2017 - Okinawa, Japan|
持續時間: 2017 十二月 3 → 2017 十二月 6
|Conference||20th International Symposium on Advances in Abrasive Technology, ISAAT 2017|
|期間||17-12-03 → 17-12-06|
All Science Journal Classification (ASJC) codes