Surface warpage measurement of wood at elevated temperature by shadow moiré method

Terry Yuan Fang Chen, Yu Sheng Chen

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

A full-field method to measure the surface warpage of wood plate at elevated temperature by phase-shifted shadow moiré method is presented. Test of the method on a cypress wood plate is demonstrated. A comparison of the test results at room temperature to the ones obtained by contact type sensor was made. A good agreement between them is shown. Further measurement of the plate warpage at elevated temperature reveals the warping behavior of wood plate.

原文English
主出版物標題Sensors, Measurement and Intelligent Materials
頁面799-802
頁數4
DOIs
出版狀態Published - 2013
事件2012 International Conference on Sensors, Measurement and Intelligent Materials, ICSMIM 2012 - Guilin, China
持續時間: 2012 12月 262012 12月 27

出版系列

名字Applied Mechanics and Materials
303-306
ISSN(列印)1660-9336
ISSN(電子)1662-7482

Other

Other2012 International Conference on Sensors, Measurement and Intelligent Materials, ICSMIM 2012
國家/地區China
城市Guilin
期間12-12-2612-12-27

All Science Journal Classification (ASJC) codes

  • 一般工程

指紋

深入研究「Surface warpage measurement of wood at elevated temperature by shadow moiré method」主題。共同形成了獨特的指紋。

引用此