System thermal analysis of 3D IC on ESL virtual platform

Lih Yih Chiou, Liang Ying Lu, Zhao Hong Chen, Yu Hsiung Su, Jen Chieh Yeh, Yi Fan Chen, Shih Che Lin

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

With the growing demand of multiprocessor system-on-chip (MPSoC) and 3D IC technology evolution, it is crucial to address power and thermal issues during system architecture design. Electronic system level (ESL) design is an acknowledged effective methodology to explore system design by virtual platforms. However, and to our best knowledge, current ESL virtual platforms only consider the performance and power issues. Therefore, we propose a run-time system thermal analysis framework for applications to an ESL virtual platform in order to analyze the thermal issue at an abstract level. In the experiment, the average estimation error of temperature was 3.18%, while the maximal estimation error was only 6.36% for ANSYS ICEPAK. The framework thus can help system designers explore power and thermal management at the early stages of IC development.

原文English
主出版物標題ISOCC 2013 - 2013 International SoC Design Conference
發行者IEEE Computer Society
頁面394-397
頁數4
ISBN(列印)9781479911417
DOIs
出版狀態Published - 2013 一月 1
事件2013 International SoC Design Conference, ISOCC 2013 - Busan, Korea, Republic of
持續時間: 2013 十一月 172013 十一月 19

出版系列

名字ISOCC 2013 - 2013 International SoC Design Conference

Other

Other2013 International SoC Design Conference, ISOCC 2013
國家/地區Korea, Republic of
城市Busan
期間13-11-1713-11-19

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 電氣與電子工程

指紋

深入研究「System thermal analysis of 3D IC on ESL virtual platform」主題。共同形成了獨特的指紋。

引用此